Apple has acknowledged the iPhone 3G's reception issues, appearing to confirm that the iPhone OS 2.0.2 software update was designed to fix those problems.
Apple has released an update for the firmware for its iPhone 3G but has refused to give details of 'OS 2.0.2', beyond saying it incorporates "bug fixes".
Reception problems with the iPhone 3G are occurring in towns and cities across the US, based on readers' responses last week to a request for more information about their experiences with the handset.
Rambus, which develops chip interface technology, is turning its attention beyond chipmakers to computer vendors as potential targets for its licensing business.
Microsoft is talking up support for hardware-based security in Windows Vista, though only a sliver of the company's original plan will make it into the operating system.
The United States moves forward with a plan to put RFID chips and biometric data in passports by early next year.
Countries begin test programs -- get ready for a facial scan the next time you take an overseas flight.
Intel today said it was too early to rule out the possibility that its components played a role in technical glitches that forced Hewlett-Packard to recall memory modules in 900,000 of its portable PCs.
AMD, Infineon and United Microelectronics are to work together to develop manufacturing processes that allow even more microelements to be included in chips.
Intel's new'Prescott' Pentium 4 has double the L1 and L2 cache of its 'Northwood' predecessor. An extended 31-stage pipeline accounts for the fact that the new chip is mostly slower than the CPU it replaces.
IBM and Infineon will jointly present a paper this week that demonstrates how MRAM, one of the leading candidates to replace flash memory in mobile phones, could be ready for commercial production by 2005.
Chip maker Infineon has developed a 'smart' fabric that can detect movement, changes in temperature or display advertising slogans on airships.
The German chipmaker is expanding its research and development facilities and staff in its Asia-Pacific unit to concentrate on developing chip packages, microcontrollers and communications chips.
The exploding costs of fabrication facilities, combined with the technical hurdles of the next generation of chip design seem like unassailable hurdles for the microchip vendors and manufacturers.
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